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1、InteI公司的MAX10FPGA系列采用TSMC55nmNOR闪存技术,容量从2K到50K逻辑单元(1E),采用单个或双核电源电压和小尺寸3x3IT1m和高I/O引脚数封装;器件具有全特性FPGA功能,支持Ni里II软核嵌入处理器,蚯信号处理(DSP)区块以及软3存储器控制器,内部存储双配置闪存,用户闪存存储器,集成了模数转换器(ADe).主要用在系统管理,I/O扩展,通信控制,工业应用,汽车电子和消费类电子.本文介绍了Inte1MAX10FPGA系列主要优势,器件平面布局图以及MAX10FPGA开发套件主要特性和电路图.Inte1MAX10FPGAsrevo1utionizenon-vo1
2、ati1eintegrationbyde1iveringadvancedprocessingcapabi1itiesina1ow-cost,sing1echipsma11formfactorprogrammab1eIogiCdevice.Bui1dinguponthesing1echipheritageofpreviousMAXdevicefami1ies,densitiesrangefrom2K-50K1Es,usingeithersing1eordua1-corevo1tagesupp1ies.TheMAX10FPGAfami1yencompassesbothadvancedsma11wa
3、fersca1epackaging(3mmx3mm)andhigh1/0pincountpackagesofferings.MAX10FPGAsarebui1tonTSMC,s55nmembeddedNORf1ashtechno1ogy,enab1inginstant-onfunctiona1ity.Integratedfeaturesinc1udeana1og-to-digita1converters(ADCs)anddua1configurationf1asha11owingyoutostoreanddynamica11yswitchbetweentwoimagesonasing1echi
4、p.Un1ikeCP1Ds,MAX10FPGAsa1soinc1udefu11-featuredFPGAcapabi1ities,suchasNiosIIsoftcoreembeddedprocessorsupport,digita1signa1processing(DSP)b1ocks,andsoftDDR3memorycontro11ers.Inte1MAX10devicesaresing1e-chip,non-vo1ati1e1ow-costprogrammab1e1ogicdevices(P1Ds)tointegratetheoptima1setofsystemcomponents.T
5、hehigh1ightsoftheInte1MAX10devicesinc1ude: Interna11ystoreddua1configurationf1ash Userf1ashmemory Instantonsupport Integratedana1og-to-digita1converters(ADCs) Sing1e-chipNiosIIsoftcoreprocessorsupportTheMAX?10devicesconsistofthefo11owing: 1ogicarrayb1ocks(1ABs) Ana1og-to-digita1converter(ADC) Userf1
6、ashmemory(UFM) Embeddedmu1tip1ierb1ocks Embeddedmemoryb1ocks(M9K) C1ocksandphase-1ocked1oops(P11) Genera1purposeI/O High-speed1VDSI/O Externa1memoryinterfaces Configurationf1ashmemory(CFM)Inte1MAX10devicesaretheidea1so1utionforsystemmanagement,I/Oexpansion,communicationcontro1p1anes,industria1,autom
7、otive,andconsumerapp1ications.Inte1MAX10FPGA系列主要优势:图1.Inte1MAX10FPGA器件平面布局图MAX10FPGA开发套件TheMAX?10FPGAdeve1opmentboardprovidesahardwarep1atformforeva1uatingthePerformanceandfeaturesoftheA1tera?MAX10device.Thedeve1opmentkitinc1udesaRoHS-andCE-comp1iantMAX10FPGADeve1opmentboardwiththefo11owingcomponent
8、s:FeaturedDevices: MAX10FPG(10M50D,dua1supp1y,F484package) Enpirion?EN2342QI4APowerSoCVo1tage-ModeSynchronousStep-DownConverterWithIntegratedInductorEnpirion EN6337QI3AHigh-EfficiencyPowerSoCDC-DCStep-DownConverterswithIntegratedInductor EnpirionEP5358xUI600mAPowerSoCDC-DCStep-DownConverterswithInte
9、gratedInductor MAXIICP1D-EPM1270M256C4N(On-boardUSB-B1asterraII) ProgrammingandConfiguration: EmbeddedUSB-B1asterII(JTAG) Optiona1JTAGdirectvia10-pinheader MemoryDevices: 64-Mx161GbDDR3SDRAMwithsoftmemorycontro11er 128-Mx81GbDDR3SDRAMwithsoftmemorycontro11er 512-MbQuadseria1periphera1interface(quadS
10、PI)f1ash CommunicationPorts: TwoGigabitEthCrnCt(GbE)RJ_45ports EthernetPortA(Bottom) EthernetPortB(Top) Onemini-USB2.0UART Onehigh-definitionmu1timediainterface(HDMI)videooutput Oneuniversa1high-speedmezzaninecard(HSMC)connector Two12-pinDigi1entPmodwcompatib1econnectors Ana1og: TwoMAX10FPGana1og-to
11、-digita1converter(ADC)SMinputs 2x10DCheader PotentiometerinputtoDC Oneexterna116bitdigita1-to-ana1ogconverter(DAC)devicewithSMAoutput C1ocking 25MHzsing1e-ended,externa1osci11atorc1ocksource Si1iCoCIabSc1ockgeneratorwithprogrammab1efrequencyGUI Mini-USBcab1eforon-boardUSB-B1asterII 2APowerSupp1yandc
12、ord FreeQuartus?IIWebEditiondesignsoftware(down1oadsoftwareand1icensefromwebsite) Comp1etedocumentation Usermanua1,bi11ofmateria1s,schematic,andboardfi1es图2.MAX10FPGA开发板正面元件图图3.MAX10FPGA开发板背面元件图图4.MAX10FPGA开发板系统框图图7.MAX10FPGA开发板电路图(2)图8.MAX10FPGA开发板电路图图9.MAX10FPGA开发板电路图(4)图10.MAX10FPGA开发板电路图(5)图I1MA
13、X10FPGA开发板电路图(6)图12.MAX10FPGA开发板电路图(7)图15.MAX10FPGA开发板电路图(10)图16.MAX10FPGA开发板电路图(11)图17.MAX10FPGA开发板电路图(12)图18.MAX10FPGA开发板电路图(13)图19.MAX10FPGA开发板电路图(14)图20.MAX10FPGA开发板电路图(15)图21.MAX10FPGA开发板电路图(16)图24.MAX10FPGA开发板电路图(19)图25.MX10FPGA开发板电路图(20)图26.MAX10FPGA开发板电路图(21)图27.MAX10FPGA开发板电路图(22)图28.MAX10FPGA开发板电路图(23)图29.MX10FPGA开发板电路图(24)图32.MAX10FPGA开发板电路图(27)图33.MAX10FPGA开发板电路图(28)图34.MAX10FPGA开发板电路图(29)图35.MAX10FPGA开发板电路图(30)图36.MAX10FPGA开发板电路图(31)