ASM固晶机 809操作手册[1].docx

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1、第3章操作步骤本章会逐步指示如何操作AD809-06自动管芯焊机，由工作夹具载具上的PCB至银浆盘和芯片环。3.1机器初始化动作屏幕显示-开启主电源-开启马达电源-开启三盏照明灯、摄像机及显示器-约需等待一分钟让机器初始化-初始化之后ASMPR SYSTEMASM Assembly Automation Ltd.AD809PAutomatic Die BonderSingle WaferSystem initialization inprogress.please wait* As M *0Bond Arm1Bond Head#Wafer Set13Wafer Table4Wafer PRS5

2、Work Holder6Ejector7Ejector ValveOff8Collet VacuumOff9Epoxy Drum SoleSETUP3.2测试模件选择动作屏幕显示- 按MODEAUTOSETUPBD PARSERVWH PARTCHPCBALNPCB- 按ADV或RTD选取DIAG- 按ENTER0Test Bond1Select Test Modules!2Check Missing Steps3Single Step TestDisable4Video ModeDisableDIAGNOSTIC MODE- 按1或按ADVRTD选取1 SelectTestModules然后

3、按ENTER（备注:两种方法均可在驱动式操作表进行选择）0Bond ArmEnable1Bond HeadEnable2EjectorEnable3Wafer TableEnable4WHEnable5ValvesEnableSELECT TEST MODULES- 按ADV或RTD选取工程,然后按ENTER在Enable/Disable 之间切换- 可用相同方法激活其它工程DIAGNOSTIC MODE0Test Bond1Select Test Modules2Check Missing Steps3Single Step TestDisable4Video ModeDisable-按ST

4、OPJ返回Diagnostic模式（备注:当关闭该工程时,在其它模式操作时均失去功能）33图像识别设定动作屏幕显示-按MODE-按ADV或RTD选择SETUP-按ENTER-按4AUTOsetupFBD PARSERVDIAGWH PARTCHPCBALNPCB0Bond Arm1Bond Head#Wafer Set13Wafer Table4Wafer PRS5Work Holder6Ejector7Ejector ValveOff8Collet VacuumOff9Epoxy Drum SoleSETUP-按0PR SETUP0Adjust Video Level1Load Refere

5、nce2Adjust Search Range*3Calibration4Search AlgorithmStreet5Chiplnk Reject Size4066Angle Acceptance (+/-)57Search Die8Pattern Die Srch Code09Clear all PR Reference屏幕-按PR SETUP0Adjust Video LevelDONE1Load Reference2Adjust Search Range3Calibration*4Search AlgorithmStreet5Chiplnk Reject Size4066Angle A

6、cceptance (+/-)57Search Die8Pattern Die Srch Code09Clear all PR ReferenceLoad good diePress ENTER to accept-按ADV或RTD调校数字化图像，使屏幕显示黑白图案-按ENTER-用控制杆或按数字键1, 2,4及把管芯移进屏幕光标。-按ADV或RTD为Load inked die?在YES/NO之间切换进行选择。-按ENTER-如答复NO,机器将会拒绝加载印墨管芯。动作屏幕显示如答复YES,必须定位印墨的区域并用1,4及移动光标定位方块到第1点,然后按ENTERo再把光标移到第2点，固定方块内

7、的区域 然后按ENTER。光襟在加载印墨管芯后按出NTER按按ADV或RTD选择搜索范围按ENTER按Press any key to resumePR SETUP0Adjust Video LevelDONE1Load ReferenceDONE2Adjust Search Range3Calibration*4Search AlgorithmStreet5Chiplnk Reject Size4066Angle Acceptance (+/-)57Search Die8Pattern Die Srch Code09Clear all PR ReferencePR SETUP0Adjust

8、Video LevelDONE1Load ReferenceDONE2Adjust Search RangeDONE3Calibration4Search AlgorithmStreet5Chiplnk Reject Size4066Angle Acceptance (+/-)57Search Die8Pattern Die Srch Code09Clear all PR Reference按ENTER等候5秒Calibration donePress any key to resume按STOP返回SETUP操作表3.4芯片工作台设定ACTION-按MONITOR DISPLAYWAFER

9、TABLE SETUP0 Show Wafer Center1 Teach Wafer Limit2 Teach Start Pos,n3 Teach Load Pos,n4 Teach Pitch5 Edit Polygon Vertex6 Show Wafer Limit7 Wafer PRSEnable-按1（编写芯片限位）-按ADV或RTD选择这工程的数值-按ENTER-如这工程的数值是Polygon,那么输入这个多边形的角数并按ENTER。用控制杆移动芯片使其全部角附合屏幕光标,每次按ENTERJ键光标会到达这些角。这些角的点会围住芯片上的所有管芯。- 如这工程的数值是Circle,

10、那么输入3点，它会定位于芯片环的限定位置- 在输入全部限定点之后，屏幕会显示- 按出NTER,芯片工作台将移动及显示所有已确定的芯片限位。Number of pt (3-10) ?Show wafer limit? YESWAFER TABLE SETUP0 Show Wafer Center1 Teach Wafer Limit2 Teach Start Pos,n3 Teach Load Pos,n4 Teach Pitch5 Edit Polygon Vertex6 Show Wafer Limit7 Wafer PRSEnable- 按- 用操制杆定位管芯在光标块内- 按出NTER（备

11、注:这是拾取管芯的起始位置）- 按- 用控制杆移动芯片工作台到便于更换芯片环为其它芯片的位置- 按ENTERLearn pitchlocate a diethen press ENTER to startCalibration donePress any key to resume- 按4- 用控制杆定位管芯到光标块内- 按ENTER- 按出NTER- 按STOP返回SETUP操作表3.5 银浆偏距编写AUTOSETUP BD PAR SERVACTION方法1- 按MODE- 按ADV或RTD选取AUTO- 按ENTERMONITOR DISPLAYDIAG WH PAR TCHPCB AL

12、NPCBAUTO BOND0Auto Bond 1Single Cycle Bond2Unload Wafer3Wafer PREnable4Manual Align PCB5Edit Bond Point6Goto Bond pt07Epoxy Offset8Missing Die DetectEnable9Replace Picked DieEnable- 按（确定PCB已被加载到工作夹具）- 按出NTER（确定调校银浆）- 按出NTERJ确定- 按ADV或RTD选取SETUP- 按ENTER方法2- 按MODE- 按ADV或RTD选取SETUP- 按- 按5（步骤如上）Move table to epoxy posln by usingjoystickEpoxy offset learnedPress any key to resumeAUTOsetupEBD PARSERVDIAGWH PARTCHPCB