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1、TOYOTAENGINEERINGSTANDARDNo.：TSCO507GTIT1E:BenChtestmethodforWhiSkrrresistancePerformanCeOfautomotivee1ectricande1ectronicequipmentC1ASS:C1EstabIishediZRevised:Rsv.4(JUI.2023)Thisstandardhasbeentevisedasaresu1tmain1yofthefo11owingchanges:(1) thetestse1ectionf1owcharthasbeenchanged(Section4);(2) thet
2、emperature/humidity.cyc1ingtesthasbeenchangedtohigh-temperature/high-humidityexposuretest(Section6.5);(3) astatementconcerningthenecessity/non-necessityofhigh-temperatureexposuretesthasbeenadded(Section6.8),and(4) theentryexamp1eoftestp1anforhigh-temperature/high-humidityexposuretesthasbeenadded(App
3、endixTab1e1).PreparedandWrittenby:E1ectronicPerformanceDeve1opment&EngineeringDept.E1ectronicsContro1SystemDeve1opmentDiv.DesignQua1ityInnovationDept.TOYOTAMOTORCORPORATIONBenChtestmethodforWhiSkerresistanceperformanceOfautomotivee1ectricande1ectronicequipment1.ScopeThisstandardcoversthebenchtestmet
4、hodtoeva1uatewhiskersthataregeneratedfromp1atingandso1derofautomobi1ee1ectricande1ectronicequipment(computer,actuator,etc.)anditsperiphera1parts/components.Specificexamp1esofportionstobeeva1uatedinc1udesubstratesformounting,e1ements,andcomponentparts(screws/bo1ts,shie1dingp1ates,cases,connectors,bus
5、bars,etc.)Fortheitemswhoseconditionsarenotspecifiedindetai1here(measurementrange,testconditions,etc.),theconditionssha11bedeterminedinconsiderationofthedesignspecificationsbyagreementbetweenthedepartmentsconcerned.2. Definitions(I)Automotivee1ectronicequipment(hereinafterreferredtoas“equipment)Thist
6、ermreferstothedevicesusedtocontro1asystemore1ectroniccontro1unit(ECU)consistingmain1yofsemiconductordeviges,aswe11asVarioustypesofsensingunitsande1ectromagneticequipment(actuators)thatareusedincombinationwiththedevices.(2) CharacteristicsThisreferstoaspecia1aspectofperformanceoftheequipmentthatcanbe
7、quantitative1yorqua1itative1yexpressedunderacertainconditionThecharacteristicssha11bespecifiedinthetestp1anfortheequipmentStandardconditionThisreferstoanatmosphericconditionunderwhichtestingandmeasurementarecarriedout,andindicatesanenvironmentmaintainedatnorma1temperature(15to35),norma1humidity(25to
8、75%RH),norma1atmosphericpressure(86to106kPa),withpoorexterna1magneticfie1dandyibration.Un1essotherwisespecified,theenvironmentinsidethetestormeasurementchambersha11bedeemedtohavebeenmaintainedinthestandardcondition.(4) Testsamp1eThistermreferstotheequipmentthatistested.(5) WhiskerWhiskerreferstoafib
9、rouscrysta1grownfrommeta1.Inthisstandard,whiskersha11meetthefo11owing2conditions.(a) Theratioofits1engthtoitsdiametersha11be2ormore.(b) Its1engthsha11be10mormore.(6) Un1eadedso1derUn1eadedso1derreferstotheso1derthatdoesnotcontainthe1ead.Ingenera1,the1eadcontentatthespecifiedportionsonwhichthe1eadsha
10、11beexc1udedissupposedtobe1essthan0.1mass%.(7) XYp1aneprojectionXYp1aneprojectionreferstoprojectionoftheshadeofobjectshapesonXYp1anebypara11e11ightrays.InthisstandardXYp1anereferstothep1aneusedbymicroscope.Itusua11ymeansthep1aneperpendicu1artothedirectionforobservation.Un1essotherwisespecified,thesu
11、bstratesurfaceformountingtoobservethewhiskersha11bepara11e1tothisp1ane.(8) ZaxisdirectionZaxisreferstotheaxisshowingthedepthdirectionusedwhenitindicatesstereoscopicpoints.Inthisstandard,Zaxisdirectionmeansthedirectionpara11e1toZaxisusedbymicroscope.Itusua11yindicatesthedirectionpara11e1tothedirectio
12、ntobeobserved.Un1essotherwisespecified,thesubstratesurfaceformountingtoobservethewhiskersha11beperpendicu1artothisdirection.(9) Portionstobeeva1uatedPortionstobeeva1uatedrefertoa11meta1portionsinwhichmeta1s(suchasun1eadedp1ating,so1der,zincp1ating,andbrightp1ating)thatmaycausewhiskergenerationareuse
13、dandportionswhosegeneratedwhiskermaytouchdirect1yorscatterbetweene1ectrodes.Theyarespecificexamp1esspecifiedinscope.(IO)Zincp1atingZincp1atingreferstoasurfacetreatment(p1ating)methodusingzincasthemaincomponent.Itmeansthep1atinghavingzincasacomponent,suchase1ectroga1vanizing,hotdipga1vanizing,e1ectro
14、ga1vanizedstee1sheet,andhotdipga1vanizedstee1sheet(11)Tinp1atingTinp1atingreferstoasurfacetreatment(p1ating)methodusingtinasthemaincomponent.Fordefinitionsre1atedtotinp1ating,seeTSH6535G.(12) Brightp1atingBrightp1atingreferstoap1atingusinga1argeamountofbrightener.Fordefinitionsre1atedtobrightp1ating
15、,seeTSH6535G.(13) DesignverificationDesignverificationistheactivitytoverifyquantitative1ythatthefina1specificationpartsassumedformassproductionsatisfythereiquirementsforre1iabi1ity.(14)BGA(Ba11GridArray)BGAisatypeofICpackage.OnthebacksideofBGApackages,so1derba11sarearrangedinagridpattern.3. BasicKno
16、w1edgeofWhisker3.1 WhatistheWhisker?Awhiskerisafibrousmeta11iccrysta1grownfromtinp1ating,zincp1ating,orothermeta1.Somewhiskersgroweventoa1engthofsevera1mi11imeters.Becausewhiskersaree1ectrica11yconductiveforeignmatters,awhiskerwi1fcauseashortcircuitfai1ureifitisgeneratedbetweentermina1sofane1ementorpart.Furthermore,itisapossibi1itythatawhiskergeneratedatacertainp1acescattersandfa11sbetwee
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